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Manufacturing method of thermal conduction EMI shield paint for semiconductor with copper and nickel and graphene

机译:铜镍镍石墨烯半导体导热EMI屏蔽涂料的制造方法

摘要

The present invention relates to a method for manufacturing a thermally conductive electromagnetic wave shielding paint for semiconductor comprising copper, nickel and graphene, and more particularly, to a method for manufacturing a thermally conductive electromagnetic wave shielding paint for semiconductor, comprising: an oxide film removing step of removing an oxide film on a surface of a copper powder; A nickel coating step of coating the surface of the copper powder that has undergone the oxide film removing step with nickel to form an oxidation preventing film; And a graphene synthesis step of synthesizing graphene on the copper powder (1) through the nickel coating step,Coating the coating paint prepared according to the present invention on a heat radiating member of a semiconductor can effectively dissipate heat generated from the semiconductor device, reduce electromagnetic interference (EMI), shield the electromagnetic wave, And the like.;
机译:本发明涉及一种用于制造包含铜,镍和石墨烯的用于半导体的导热电磁波屏蔽涂料的方法,更具体地,涉及一种用于制造用于半导体的导热电磁波屏蔽涂料的方法,包括:去除氧化膜。去除铜粉表面上的氧化膜的步骤;镍涂覆步骤是在镍膜上对经过氧化膜去除步骤的铜粉表面进行覆盖以形成防氧化膜。并且,通过镍涂覆步骤在铜粉(1)上合成石墨烯的石墨烯合成步骤,将根据本发明制备的涂料涂覆在半导体的散热构件上可以有效地散发由半导体器件产生的热量,减少电磁干扰(EMI),屏蔽电磁波等。

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