首页>
外国专利>
Manufacturing method of thermal conduction EMI shield paint for semiconductor with copper and nickel and graphene
Manufacturing method of thermal conduction EMI shield paint for semiconductor with copper and nickel and graphene
展开▼
机译:铜镍镍石墨烯半导体导热EMI屏蔽涂料的制造方法
展开▼
页面导航
摘要
著录项
相似文献
摘要
The present invention relates to a method for manufacturing a thermally conductive electromagnetic wave shielding paint for semiconductor comprising copper, nickel and graphene, and more particularly, to a method for manufacturing a thermally conductive electromagnetic wave shielding paint for semiconductor, comprising: an oxide film removing step of removing an oxide film on a surface of a copper powder; A nickel coating step of coating the surface of the copper powder that has undergone the oxide film removing step with nickel to form an oxidation preventing film; And a graphene synthesis step of synthesizing graphene on the copper powder (1) through the nickel coating step,Coating the coating paint prepared according to the present invention on a heat radiating member of a semiconductor can effectively dissipate heat generated from the semiconductor device, reduce electromagnetic interference (EMI), shield the electromagnetic wave, And the like.;
展开▼