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CNT Manufacturing method of thermal conduction EMI shield paint for semiconductor with copper and nickel and CNT and graphene

机译:碳纳米管,铜,镍,碳纳米管和石墨烯的半导体用导热EMI屏蔽涂料的制造方法

摘要

The present invention relates to a method of manufacturing a thermally conductive electromagnetic wave shielding coating for a semiconductor made of copper, nickel, CNT and graphene, wherein the thermally conductive electromagnetic wave shielding coating for semiconductor comprises nickel coated on the surface of the copper powder, (CNT) and graphene synthesized in a copper powder in which the carbon nanotube (CNT) is cultivated, wherein the carbon nanotube (CNT)Coating the coating paint prepared according to the present invention on a heat radiating member of a semiconductor can effectively dissipate heat generated from the semiconductor device, reduce electromagnetic interference (EMI), shield the electromagnetic wave, And the like.
机译:本发明涉及一种由铜,镍,CNT和石墨烯制成的用于半导体的导热电磁波屏蔽涂层的制造方法,其中用于半导体的导热电磁波屏蔽涂层包括涂覆在铜粉表面上的镍, (碳纳米管)和石墨烯在其中培育有碳纳米管(CNT)的铜粉中合成,其中将根据本发明制备的涂料涂覆在半导体的散热构件上的碳纳米管(CNT)可以有效地散热从半导体器件产生的电磁波,减少电磁干扰(EMI),屏蔽电磁波,等等。

著录项

  • 公开/公告号KR101832585B1

    专利类型

  • 公开/公告日2018-02-28

    原文格式PDF

  • 申请/专利权人 인제대학교 산학협력단;

    申请/专利号KR20160002911

  • 发明设计人 조형호;전민현;유영조;황중환;

    申请日2016-01-08

  • 分类号C09D1/00;C09D5/00;C09D7/12;C23C16/26;C23C16/44;H01L21/02;H01L29/16;

  • 国家 KR

  • 入库时间 2022-08-21 12:38:20

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