High-Tech Temperature Control Device for Semiconductor Manufacturing Facilities

摘要

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an advanced temperature control apparatus for a semiconductor manufacturing facility, and more particularly, to an advanced temperature control apparatus for an electrostatic chuck that supports a wafer and maintains a temperature in a semiconductor wafer processing process. The temperature and mixing flow rate of the heating heat medium and the cooling heat medium are kept constant and the mixing ratio is controlled, so that very precise control over the temperature of the static chuck is made possible. On the other hand, after heating and cooling, the heating medium can be recovered and reused for efficient utilization of energy.