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Semiconductor manufacturing process with height control through an active region profile and semiconductor manufacturing system

机译:通过有源区域轮廓和半导体制造系统进行高度控制的半导体制造工艺

摘要

Method, comprising in sequence: Forming a trench (225) on a semiconductor substrate (210) defining active fin regions (230); Extracting a profile of the fin active regions (230); Determining an etch dosage dependent on the profile of the fin active regions (230); Filling the trench (225) with a dielectric (240); and Performing an etch process on the dielectric (240) using the determined etch dosage, thereby recessing the dielectric (240) and defining a fin height of the fin active regions (230).
机译:该方法包括以下步骤:在限定有源鳍区(230)的半导体衬底(210)上形成沟槽(225);提取鳍有源区的轮廓(230);根据鳍有源区域的轮廓确定蚀刻剂量(230);用电介质(240)填充沟槽(225);使用确定的蚀刻剂量对电介质(240)执行蚀刻工艺,从而使电介质(240)凹陷并限定鳍有源区(230)的鳍高度。

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