Microcoil device for inductive balancing in packages and PCBs for arrangements with discontinuous and buried vias

摘要

The device uses micro-coil structures that electrically connect through-metallization (PTH) structures to Ball Grid Array (BGA) pads. The microcoil structures produce inductive effects that counteract capacitive reflections produced by the PTH and BGA pad structures that form a plate-type natural capacitor. In addition, the inductive effects can be adjusted by varying the amount of coil windings and the dimensions of the coil structures.