A process for the production of plano-convex lens elements and for the production of a packaged device at the wafer level

摘要

A manufacturing method 100 comprises fixing 200 of ball elements 14 made of a semiconductor material by means of heat and pressure on a carrier substrate 22; and one-sided thinning 300 of the ball members 14 fixed to the support substrate 22 to form plano-convex lens elements 24 of a semiconductor material.