Novel Integrated Package-on-Package for Wafer Level and Panel Level Production

摘要

Wafer Level Packaging (WLP) technology has grown to become the backbone of miniaturization solution for mobile devices. Package on Package (PoP) in particular is used to combine memory and APU SOC in smartphones. Here, a novel, ultrathin, integrated PoP (InPoP) suitable for either wafer level or panel level production is described in detail.