METHOD AND APPARATUS FOR PERFORMING RLC MODELING AND EXTRACTION FOR THREE-DIMENSIONAL INTEGRATED CIRCUIT (3D-IC) DESIGNS

摘要

One embodiment of the present invention provides a system that performs an RLC extraction for a three-dimensional integrated circuit (3D-IC) die. During operation, the system receives a 3D-IC die description. The system then transforms the 3D-IC die description into a set of 2D-IC die descriptions, wherein the transform maintains equivalency between the set of 2D-IC die descriptions and the 3D-IC die description. Next, for each 2D-IC die description in the set of 2D-IC die descriptions, the system performs an electrical property extraction using a 2D-IC extraction tool to obtain a 2D-IC RLC netlist file. The system then combines the set of 2D-IC RLC netlist files for the set of 2D-IC die descriptions to form an RLC netlist file for the 3D-IC die description.