HEAT DISSIPATION STRUCTURE OF ELECTRONIC COMPONENT

摘要

To provide a heat dissipation structure of an electronic component that can efficiently transfer heat of a heating element to a radiator to improve a heat dissipation effect.SOLUTION: A heat dissipation structure 20 comprises: a semiconductor device 10; a substrate 11; heat spreaders 13; copper inlays 14; an insulating layer 15; and a heat sink 16. The substrate 11 has the semiconductor device 10 arranged on a first surface 11a and to which heat of the semiconductor device 10 is transferred. The heat spreaders 13 are arranged in proximity to the semiconductor device 10 on the first surface 11a and spread the heat transferred to the substrate 11. The copper inlays 14 are provided in the substrate 11, and have copper inlays 14a arranged to extend over the semiconductor device 10 and heat spreaders 13 on the first surface 11a and copper inlays 14b arranged at positions where heat is transferred from the heat spreaders 13. The heat sink 16 is arranged on a second surface 11b of the substrate 11 and dissipates heat transferred via the copper inlays 14 to the atmosphere.SELECTED DRAWING: Figure 2