首页> 外国专利> PRINTED WIRING BOARD WITH TEMPORARY REINFORCING PLATE AND MANUFACTURING METHOD THEREOF, MANUFACTURING METHOD OF PRINTED WIRING BOARD, AND MOUNTING METHOD OF ELECTRONIC COMPONENT ON PRINTED WIRING BOARD

PRINTED WIRING BOARD WITH TEMPORARY REINFORCING PLATE AND MANUFACTURING METHOD THEREOF, MANUFACTURING METHOD OF PRINTED WIRING BOARD, AND MOUNTING METHOD OF ELECTRONIC COMPONENT ON PRINTED WIRING BOARD

机译:带有临时补强板的印刷线路板及其制造方法,印刷线路板的制造方法以及在印刷线路板上的电子部件的安装方法

摘要

PROBLEM TO BE SOLVED: To solve a problem caused by residues such as adhesive on the surface of a covering insulating layer and the surface of a conductor pad.;SOLUTION: A temporary reinforcing board with a printed wiring board 10 includes an interlayer insulating layer 18 made of an insulating material, a conductor layer 16 including a conductor pad 16a formed on the interlayer insulating layer 18, a covering insulating layer 24 formed on the interlayer insulating layer 18 and the conductor layer 16 and having a plurality of openings 24a exposing the conductor pads 16a, a metal layer 28 formed on the covering insulating layer 24 and the conductor pad 16a, and a temporary reinforcing plate 14 stuck on the metal layer 28.;SELECTED DRAWING: Figure 1;COPYRIGHT: (C)2019,JPO&INPIT
机译:解决的问题:解决由覆盖绝缘层的表面和导体焊盘的表面上的诸如粘合剂之类的残留物引起的问题;解决方案:具有印刷线路板的临时增强板10包括层间绝缘层18由绝缘材料制成的导体层16,其包括形成在层间绝缘层18上的导体焊盘16a,形成在层间绝缘层18和导体层16上的覆盖绝缘层24,并具有多个暴露导体的开口24a焊盘16a,形成在覆盖绝缘层24和导体焊盘16a上的金属层28以及粘贴在金属层28上的临时加强板14 .;图1;版权:(C)2019,JPO&INPIT

著录项

  • 公开/公告号JP2019054092A

    专利类型

  • 公开/公告日2019-04-04

    原文格式PDF

  • 申请/专利权人 IBIDEN CO LTD;

    申请/专利号JP20170176840

  • 发明设计人 FURUTA TORU;TAIZO TOMOYA;IKEDA KOSUKE;

    申请日2017-09-14

  • 分类号H05K3/46;H05K3;H01L23/12;

  • 国家 JP

  • 入库时间 2022-08-21 12:22:31

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