Wafer processing apparatus having capacitive microsensor

摘要

Embodiments include apparatus and methods for detecting particles, monitoring etching or deposition rates, or controlling the steps of a wafer manufacturing process. In one embodiment, a particle monitoring device for particle detection includes a number of capacitive microsensors mounted on a wafer substrate and detects particles under all pressure conditions, eg, vacuum conditions. In one embodiment, one or more capacitive microsensors are attached to the wafer processing tool to measure material deposition and removal rates in real time during the wafer manufacturing process. Other embodiments are also described and claimed. [Selection] Figure 4