Laminated top plate of workpiece carrier in micromechanical and semiconductor processing

摘要

A stacked top plate of workpiece carriers is described as being particularly suitable for micromechanical and semiconductor processing. In one embodiment, a method of manufacturing a workpiece carrier top plate includes providing a conductive paste on at least one of a plurality of ceramic sheets, embedding a paste between the plurality of ceramic sheets, And compressing the ceramic sheet and sintering the paste. [Selection] Figure 8