Method for filling via holes of ceramic substrate and via hole filling for ceramic substrate filled using the same

摘要

The present invention relates to a method for filling a via hole of a ceramic substrate and a via hole filling for a ceramic substrate filled using the same, wherein a via hole is formed in a ceramic base and a conductor is formed in the via hole, By melting and further cooling the conductor in a vacuum state, the via hole of the ceramic substrate can be easily filled with the conductor without pores, thus simplifying the manufacturing process of the ceramic substrate and reducing the manufacturing cost. Improves the operation reliability of the ceramic substrate and ensures stable operation reliability when used in a high power semiconductor module. [Selected figure] Figure 2