METHOD FOR FILLING VIA HOLE OF CERAMIC SUBSTRATE AND CERAMIC SUBSTRATE VIA HOLE FILLER FORMED THEREBY

摘要

The present invention relates to a method for filling a via hole of a ceramic substrate and a ceramic substrate via hole filler formed thereby. A via hole is formed on a ceramic substrate, a conductor is formed inside the via hole, and the conductor is then melted in a vacuum state and cooled again. As such, the via hole of the ceramic substrate can be simply filled with a conductor without a pore. Consequently, the ceramic substrate manufacturing process is simplified, manufacturing costs are reduced, the operating reliability of the ceramic substrate is improved, and stable operating reliability is ensured when used for a high-power semiconductor module.