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Self-supporting GaN substrate, method of manufacturing GaN single crystal, method of manufacturing semiconductor device, and GaN layer bonding substrate and method of manufacturing the same

机译:自支撑GaN衬底,GaN单晶的制造方法,半导体器件的制造方法,以及GaN层接合衬底及其制造方法

摘要

An object is to provide a nonpolar or semipolar GaN substrate having improved size and crystal quality. A self-standing GaN substrate has an angle between the normal of the principal surface and an m-axis of 0 degrees or more and 20 degrees or less, wherein: the size of the projected image in a c-axis direction when the principal surface is vertically projected on an M-plane is 10 mm or more; and when an a-axis length is measured on an intersection line between the principal surface and an A-plane, a low distortion section with a section length of 6 mm or more and with an a-axis length variation within the section of 10.0 × 10 -5 Å or less is observed.
机译:一个目的是提供具有改善的尺寸和晶体质量的非极性或半极性GaN衬底。自支撑式GaN衬底的主表面法线与m轴之间的夹角为0度以上且20度以下,其中:当主表面时,投影图像在c轴方向上的大小垂直投影在M平面上的距离为10 mm以上;并且,在主面与A面的交线上测量a轴长度的情况下,截面长度为6mm以上,且a轴长度的偏差在10.0×以内的低变形截面。观察到10 -5或更小。

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