To provide a rigid-flex multilayer printed wiring board capable of suppressing cracking of an insulating base material at a boundary portion between a flexible substrate portion and a rigid substrate portion when the flexible substrate portion is bent, even with a rigid-flex multilayer printed wiring board in which a flexible substrate portion is formed by cutting using resin-impregnated glass cloth for all layers.SOLUTION: The rigid-flex multilayer printed wiring board includes a flexible substrate portion formed by machining while, as an insulating base material, resin impregnated glass cloth is disposed in all layers. At a boundary portion between the flexible substrate portion and a rigid substrate portion at a cutting opening portion of the flexible substrate portion, an insulating base material remaining part and/or a conductor layer is included.SELECTED DRAWING: Figure 1
展开▼
