Defect detection apparatus, defect detection method, wafer, semiconductor chip, die bonder, semiconductor manufacturing method, and semiconductor device manufacturing method

摘要

A defect detection device for detecting a defect having at least an inclined surface portion in a semiconductor product or a workpiece that is a part of the semiconductor product. The inspection mechanism is provided with an illumination unit that emits bright field illumination light to the workpiece, and an imaging device that configures an observation optical system and observes the observation portion of the workpiece illuminated by the illumination unit. The inspection mechanism observes the reflected light from the workpiece emitted from the out-of-focus position defocused from the in-focus position in the optical axis direction, and detects the defect on the observation image formed by the reflected light from the out-of-focus position And emphasize the defect on the observation image formed by the reflected light from the in-focus position.