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An Active Deep Learning Method for the Detection of Defects in Power Semiconductors

机译:功率半导体中缺陷检测的主动深度学习方法

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Accurate detection of semiconductor defects is crucial to ensure reliability of operation and to improve yield by understanding and eradicating yield detractors. Recent advances in computer vision driven by Deep Convolutional Neural Networks (DCNN) and transfer learning have enabled novel techniques for defect detection and classification [1-7]. However, training neural networks requires very large datasets, even with transfer learning. This paper addresses this shortcoming by introducing for the first time the active learning approach for semiconductor devices. The proposed neural network can accurately identify defective dies with modest efforts in terms of annotating the image set. Finally, the feature maps of the DCNN are used to generate an unsupervised taxonomy of the semiconductor die defects, supporting further investigations to address yield detractors.
机译:精确地检测半导体缺陷是至关重要的,以确保操作的可靠性并通过理解和消除产量折断剂来提高产量。 深度卷积神经网络(DCNN)和转移学习驱动的计算机视觉上的最新进展使新颖的缺陷检测和分类技术进行了新的技术[1-7]。 然而,即使通过转移学习,培训神经网络也需要非常大的数据集。 本文通过首次引入半导体器件的主动学习方法来解决这种缺点。 所提出的神经网络可以在注释图像集方面,准确地识别具有适度努力的缺陷模具。 最后,DCNN的特征映射用于产生半导体管芯缺陷的无监督分类,支持进一步调查,以解决产量折断剂。

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