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Molding polyimide film with adhesive layer, the laminate of the molding polyimide film band with adhesive layer, laminate, molding polyimide film band with adhesive layer single-layer or multi-layer wiring plate and multilayer wiring board fabrication method
Molding polyimide film with adhesive layer, the laminate of the molding polyimide film band with adhesive layer, laminate, molding polyimide film band with adhesive layer single-layer or multi-layer wiring plate and multilayer wiring board fabrication method
Provided is a material which obviates the need for etching after a hot pressing step and with which it is possible to obtain an insulation layer having a suitable surface roughness for a semi-additive process and to produce a single-layer or multilayer wiring board having good flatness. Specifically, the present invention provides a mold-release polyimide film with an adhesive layer, said film having, on the surface of a polyimide film, a mold-release layer and adhesive layer, wherein the adhesive layer comprises a polyfunctional epoxy resin, an epoxy resin curing agent, and a phenolic hydroxyl group-containing polyamide resin.
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