The present invention provides a solder alloy that suppresses the occurrence of unfusion due to its low melting point, improves ductility and bonding strength, and has excellent heat cycle resistance. A solder alloy has an alloy composition of Bi: 35 to 68%, Sb: 0.1 to 2.0%, Ni: 0.01 to 0.10%, and the balance being Sn. . Preferably, at least one of Co, Ti, Al, and Mn is contained in a total of 0.1% or less. Moreover, this solder alloy can be suitably used for solder paste, solder balls, cored solder, and solder joints. [Selection] Figure 1
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