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Method of manufacturing an integrated fan-out package having fan-out redistribution layer (RDL) to accommodate electrical connectors
Method of manufacturing an integrated fan-out package having fan-out redistribution layer (RDL) to accommodate electrical connectors
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机译:制造具有扇出重新分布层(RDL)以容纳电连接器的集成扇出封装的方法
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摘要
A method includes forming a through-via from a first conductive pad of a first device die. The first conductive pad is at a top surface of the first device die. A second device die is adhered to the top surface of the first device die. The second device die has a surface conductive feature. The second device die and the through-via are encapsulated in an encapsulating material. The encapsulating material is planarized to reveal the through-via and the surface conductive feature. Redistribution lines are formed over and electrically coupled to the through-via and the surface conductive feature.
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