首页>
外国专利>
Tin-zinc microbump structures and method of making same
Tin-zinc microbump structures and method of making same
展开▼
机译:锡锌微凸块结构及其制造方法
展开▼
页面导航
摘要
著录项
相似文献
摘要
Techniques and mechanisms for providing effective connectivity with surface level microbumps on an integrated circuit package substrate. In an embodiment, different metals are variously electroplated to form a microbump which extends through a surface-level dielectric of a substrate to a seed layer including copper. The microbump includes a combination of tin and zinc that mitigates precipitation of residual copper by promoting the formation of miconstituents in the microbump. In another embodiment, the microbump has a mass fraction of zinc, or a mass fraction of tin, that is different in various regions along a height of the microbump.
展开▼