首页>
外国专利>
Lead frame for integrated circuit device having J-leads and gull wing leads
Lead frame for integrated circuit device having J-leads and gull wing leads
展开▼
机译:具有J引线和鸥翼引线的集成电路装置的引线框架
展开▼
页面导航
摘要
著录项
相似文献
摘要
A lead frame for a packaged integrated circuit (IC) device has alternating first and second leads that protrude from a package body in respective first and second planes, where the second plane is parallel to and below the first plane. The first leads are formed into Gull Wing shaped leads and the second leads are formed into J-shaped leads. Inner lead portions of the first and second leads are maintained in the first plane with a tape. An inner lead portion of each of the second leads includes a deformation area that facilitates maintaining the tape in contact with the inner lead area of the second leads, even when a mold tool presses down on an outer lead side of the second leads to place the outer lead ends of the second leads in the second plane.
展开▼