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Integrated thermoelectric cooler for three-dimensional stacked DRAM and temperature-inverted cores
Integrated thermoelectric cooler for three-dimensional stacked DRAM and temperature-inverted cores
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机译:集成热电冷却器,用于三维堆叠式DRAM和温度反转核心
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摘要
Managing temperature of a semiconductor device having a temperature inverted processor core and stacked memory by operation of an integrated thermoelectric cooler. The thermoelectric cooler is operated to pump heat from a stacked memory device that requires a cool operating temperature to a temperature inverted processor core that maintains a higher operating temperature until threshold operating temperatures are achieved.
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