INTEGRATED THERMOELECTRIC COOLER FOR THREE-DIMENSIONAL STACKED DRAM AND TEMPERATURE-INVERTED CORES

摘要

Managing temperature of a semiconductor device having a temperature inverted processor core and stacked memory by operation of an integrated thermoelectric cooler. The thermoelectric cooler is operated to pump heat from a stacked memory device that requires a cool operating temperature to a temperature inverted processor core that maintains a higher operating temperature until threshold operating temperatures are achieved.