首页> 外国专利> TECHNIQUE AND RELATED SEMICONDUCTOR DEVICES BASED ON CRYSTALLINE SEMICONDUCTOR MATERIAL FORMED ON THE BASIS OF DEPOSITED AMORPHOUS SEMICONDUCTOR MATERIAL

TECHNIQUE AND RELATED SEMICONDUCTOR DEVICES BASED ON CRYSTALLINE SEMICONDUCTOR MATERIAL FORMED ON THE BASIS OF DEPOSITED AMORPHOUS SEMICONDUCTOR MATERIAL

机译:沉积态非晶态半导体材料为基础的基于结晶态半导体材料的半导体工艺及相关器件

摘要

A method of forming a crystalline semiconductor material on the basis of a very thin semiconductor base material and an amorphous semiconductor material deposited thereon is disclosed. Radiation-based anneal process techniques may be applied by using appropriate radiation wavelengths, for instance, below 380 nm, in order to efficiently restrict energy deposition to the surface-near area. A solid and crystalline bottom portion of the semiconductor base material may be reliably preserved, thereby achieving crystallization of the overlying material portions and, in particular, of the previously deposited amorphous semiconductor material. Extremely thin channel regions of fully depleted SOI transistor elements may be used as a semiconductor base material, upon which raised drain and source regions may be formed in a later manufacturing stage, thereby substantially avoiding any process irregularities, which are conventionally associated with the epitaxial growth of a semiconductor material on a very thin semiconductor base material.
机译:公开了一种基于非常薄的半导体基础材料和沉积在其上的非晶半导体材料形成晶体半导体材料的方法。可以通过使用适当的辐射波长(例如低于380 nm)来应用基于辐射的退火工艺技术,以便有效地将能量沉积限制在表面附近区域。半导体基底材料的固体和结晶底部可以被可靠地保留,从而实现上覆材料部分的结晶,特别是先前沉积的非晶半导体材料的结晶。可以将完全耗尽的SOI晶体管元件的极薄沟道区用作半导体基础材料,在以后的制造阶段中可以在其上形成凸起的漏极和源极区,从而基本上避免了通常与外延生长相关的任何工艺不规则性。半导体材料在非常薄的半导体基材上的沉积。

著录项

  • 公开/公告号US2019148149A1

    专利类型

  • 公开/公告日2019-05-16

    原文格式PDF

  • 申请/专利权人 GLOBALFOUNDRIES INC.;

    申请/专利号US201715810638

  • 发明设计人 ELLIOT JOHN SMITH;

    申请日2017-11-13

  • 分类号H01L21/20;H01L29/10;H01L29/78;H01L21/263;C23C14/58;H01L21/02;

  • 国家 US

  • 入库时间 2022-08-21 12:10:20

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