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Vertical FETs with different gate lengths and spacer thicknesses
Vertical FETs with different gate lengths and spacer thicknesses
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机译:具有不同栅极长度和间隔层厚度的垂直FET
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摘要
Techniques for forming VFETs with differing Lg using fins of the same height are provided. In one aspect, a method of forming a VFET device includes: patterning (first/second) fins having a uniform fin height in a substrate; forming bottom source/drains at a base of the fins; forming first bottom spacers on the bottom source/drains; selectively forming second bottom spacers (as a dopant source) at the base of the second fins; driving dopants from the bottom source/drains into the first fins and also from second bottom spacers into the second fins to form bottom junctions having a height H1 and H2, respectively, wherein H2H1; forming gates along the fins, wherein the gates along the first/second fins have Lg1/Lg2, wherein Lg1Lg2 based on H2H1; forming top spacers above the gates; and forming top source and drains above the top spacers. VFET devices are also provided.
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机译:提供了使用相同高度的鳍来形成具有不同Lg的VFET的技术。在一个方面,一种形成VFET器件的方法包括:在衬底中图案化具有均匀鳍高度的(第一/第二)鳍;在鳍的底部形成底部源/漏极;在底部源极/漏极上形成第一底部间隔物;在第二鳍的基部处选择性地形成第二底部隔离物(作为掺杂剂源);将掺杂剂从底部源极/漏极掺杂到第一鳍片中,还从第二底部间隔物驱入第二鳍片中,分别形成高度为H 1 B>和H 2 B>的底部结,其中H 2 B H 1 B>;沿着鳍片形成栅极,其中沿着第一/第二鳍片的栅极具有Lg 1 B> / Lg 2 B>,其中Lg 1 B Lg 2 B>基于H 2 B H 1 B>;在栅极上方形成顶部隔离物;在顶部隔离物上方形成顶部源极和漏极。还提供了VFET器件。
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