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Communication system having a multi-layer PCB including a dielectric waveguide layer with a core and cladding directly contacting ground planes

机译:具有多层PCB的通信系统,该多层PCB包括带芯和直接接触接地层的包层的介电波导层

摘要

Embodiments herein describe a high-speed communication channel in a PCB that includes a dielectric waveguide sandwiched between two ground layers. The dielectric waveguide includes a core and a cladding where the material of the core has a higher dielectric constant than the material of the cladding. Thus, electromagnetic signals propagating in the core are internally reflected at the interface between the core and cladding such that the electromagnetic signals are primary contained in the core.
机译:本文的实施例描述了PCB中的高速通信通道,该PCB包括夹在两个接地层之间的介电波导。介电波导包括芯和包层,其中芯的材料具有比包层的材料更高的介电常数。因此,在芯中传播的电磁信号在芯和包层之间的界面处被内部反射,使得电磁信号主要包含在芯中。

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