Reduction in radiated emission from multi-layer PCBs with two power and ground plane pairs

摘要

Radiation mechanisms of eight layer printed boards with two power-ground plane pairs have been investigated. Conventional 8 layer boards with any layer stack-up and any trace route have been found not to eliminate the peaks caused by the power and ground plane resonance. Novel layer structure board, EMI reduction board, has been developed to completely reduce the emission. The layer stack-up of the board is signal(S)-ground(G)-power(P)-signal(S)-signal(S)-power(P)-ground(G)-signal(S), and the edges of two ground planes are connected. Experimental results have shown that the EMI reduction board reduces the emission to no peak.