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Semiconductor device including ground and power-supply planes and a dielectric layer between the ground and power-supply planes

机译:半导体器件,包括接地和电源平面以及在接地和电源平面之间的介电层

摘要

A high dielectric loss tangent layer is provided in a dielectric layer between a power-supply plane and a ground plane. The high dielectric loss tangent layer is arranged such that its edge is located between the edge of the power-supply plane and the edge of the ground plane. The edge of the high dielectric loss tangent layer is preferably separated by a predetermined distance or more from the edge of the power-supply plane or the edge of the ground plane which is located on the inner side.
机译:在电源平面和接地平面之间的介电层中提供高介电损耗正切层。高介电损耗正切层被布置为使得其边缘位于电源平面的边缘与接地平面的边缘之间。高介电损耗正切层的边缘优选与位于内侧的电源平面的边缘或接地平面的边缘相距预定距离或更大。

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