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ON-CHIP, WIDEBAND, DIFFERENTIALLY FED ANTENNAS WITH INTEGRATED BIAS STRUCTURES

机译:集成偏置结构的片上宽带宽带馈电天线

摘要

Terahertz (THz) or millimeter wave (mmW) band characterization of a differential-mode device under test (DUT) is performed using a non-contact probing setup based on an integrated circuit that includes the on-chip DUT and an on-chip test fixture as follows. A differential transmission line pair is operatively coupled with the DUT. A first differential antenna pair at a first end of the transmission line pair has a first antenna connected only with the first transmission line and a second antenna connected only with the second transmission line. A second differential antenna pair is likewise connected with a second end of the differential transmission line pair. A THz or mmW transmitter radiates a probe THz or mmW beam to the first differential antenna pair, and an electronic analyzer receives a THz or mmW signal radiated by the second differential antenna pair responsive to the radiation of the probe THz or mmW beam to the first differential antenna pair, thus enabling no-contact S-parameter measurements for characterizing differential-mode, on-wafer, active or passive devices and integrated circuits.
机译:使用基于包括片上DUT和片上测试的集成电路的非接触式探测设置,可以对被测差模器件(DUT)的太赫兹(THz)或毫米波(mmW)频带进行表征治具如下。差分传输线对与DUT可操作地耦合。传输线对的第一端的第一差分天线对具有仅与第一传输线连接的第一天线和仅与第二传输线连接的第二天线。第二差分天线对同样与差分传输线对的第二端连接。 THz或mmW发射机向第一差分天线对辐射THz或mmW波束,电子分析仪响应于探头THz或mmW波束向第一差分天线的辐射,接收第二差分天线对辐射的THz或mmW信号。差分天线对,因此可以进行非接触式S参数测量,以表征差模,晶片上,有源或无源器件和集成电路。

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