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SIC SEMICONDUCTOR DEVICE HAVING PN JUNCTION INTERFACE AND METHOD FOR MANUFACTURING THE SIC SEMICONDUCTOR DEVICE

机译:具有pn结界面的sic半导体器件及其制造方法

摘要

A method for manufacturing a semiconductor device capable of reducing an ON resistance. In the present invention, a drift layer is formed on a substrate. An ion implanted layer is formed in a surface of the drift layer. A surplus carbon region is formed in the drift layer. The drift layer is heated. In a case where the surplus carbon region is formed, the surplus carbon region is formed in a region deeper than an interface between the ion implanted layer and the drift layer. In a case where the drift layer is heated, impurity ions of the ion implanted layer are activated to form an activation layer, and interstitial carbon atoms are dispersed toward the activation layer.
机译:一种能够减小导通电阻的半导体器件的制造方法。在本发明中,在基板上形成漂移层。在漂移层的表面上形成离子注入层。在漂移层中形成多余的碳区域。漂移层被加热。在形成剩余碳区域的情况下,在比离子注入层和漂移层之间的界面更深的区域中形成剩余碳区域。在漂移层被加热的情况下,离子注入层的杂质离子被激活以形成激活层,并且间隙碳原子朝着激活层分散。

著录项

  • 公开/公告号US2019237558A1

    专利类型

  • 公开/公告日2019-08-01

    原文格式PDF

  • 申请/专利权人 MITSUBISHI ELECTRIC CORPORATION;

    申请/专利号US201916374226

  • 发明设计人 KENJI HAMADA;MASAYUKI IMAIZUMI;

    申请日2019-04-03

  • 分类号H01L29/66;H01L21/322;H01L29/32;H01L29/10;H01L29/08;H01L29/868;H01L21/04;H01L29/16;H01L29/06;H01L29/861;

  • 国家 US

  • 入库时间 2022-08-21 12:07:29

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