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Recap layer scheme to enhance RRAM performance

机译:重述层方案以增强RRAM性能

摘要

An RRAM device is disclosed. The RRAM device includes a lower electrode structure over a conductive lower interconnect layer, an upper electrode structure over the lower electrode structure, and a switching layer between the lower electrode and the upper electrode structure. The switching layer has switching layer outer sidewalls. The RRAM device also includes a recap layer having a vertical portion that extends vertically from corners of the switching layer along the upper electrode sidewalls. The recap layer has a horizontal portion that extends horizontally from the corners to the switching layer outer sidewalls.
机译:公开了一种RRAM设备。 RRAM器件包括在导电的下部互连层上方的下部电极结构,在下部电极结构上方的上部电极结构以及在下部电极和上部电极结构之间的开关层。开关层具有开关层外侧壁。 RRAM器件还包括具有垂直部分的保护层,该垂直部分从开关层的角沿上电极侧壁垂直延伸。重覆层具有水平部分,该水平部分从拐角水平地延伸到开关层外侧壁。

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