首页> 外国专利> FABRICATION OF FIN FIELD EFFECT TRANSISTORS FOR COMPLEMENTARY METAL OXIDE SEMICONDUCTOR DEVICES INCLUDING SEPARATE N-TYPE AND P-TYPE SOURCE/DRAINS USING A SINGLE SPACER DEPOSITION

FABRICATION OF FIN FIELD EFFECT TRANSISTORS FOR COMPLEMENTARY METAL OXIDE SEMICONDUCTOR DEVICES INCLUDING SEPARATE N-TYPE AND P-TYPE SOURCE/DRAINS USING A SINGLE SPACER DEPOSITION

机译:互补金属氧化物半导体器件的鳍场效应晶体管的制造,包括单独的N型和P型源/漏区,采用单间隔沉积

摘要

A method of forming a complementary metal oxide semiconductor (CMOS) device on a substrate, including forming a plurality of vertical fins on the substrate, forming a first set of source/drain projections on the first subset of vertical fins, forming a second set of source/drain projections on the second subset of vertical fins, where the second set of source/drain projections is a different oxidizable material from the oxidizable material of the first set of source/drain projections, converting a portion of each of the second set of source/drain projections and a portion of each of the first set of source/drain projections to an oxide, removing the converted oxide portion of the first set of source/drain projections to form a source/drain seed mandrel, and removing a portion of the converted oxide portion of the second set of source/drain projections to form a dummy post.
机译:一种在基板上形成互补金属氧化物半导体(CMOS)器件的方法,包括在基板上形成多个垂直鳍,在垂直鳍的第一子集上形成第一组源极/漏极凸起,形成第二组垂直鳍片的第二子集上的源极/漏极投影,其中第二组源极/漏极投影是与第一组源极/漏极投影的可氧化材料不同的可氧化材料,从而转换了第二组中的每一个的一部分源极/漏极凸起和第一组源极/漏极凸起中的每一个的一部分形成氧化物,去除第一组源极/漏极凸起中转换后的氧化物部分以形成源极/漏极种子心轴,并去除一部分第二组源极/漏极凸起的转换的氧化物部分形成伪柱。

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