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CELL ARCHITECTURE WITH INTRINSIC DECOUPLING CAPACITOR
CELL ARCHITECTURE WITH INTRINSIC DECOUPLING CAPACITOR
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机译:具有内部去耦电容器的单元架构
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摘要
An IC includes an array of cells and a first set of endcap cells. The array of cells includes a first set of Mx layer power interconnects coupled to a first voltage, a first set of Mx layer interconnects, a second set of Mx layer power interconnects coupled to a second voltage source, and a second set of Mx layer interconnects. The first set of endcap cells includes first and second sets of Mx+1 layer interconnects. The first set of Mx+1 layer interconnects is coupled to the first set of Mx layer power interconnects and to the second set of Mx layer interconnects to provide a first set of decoupling capacitors. The second set of Mx+1 layer interconnects is coupled to the second set of Mx layer power interconnects and to the first set of Mx layer interconnects to provide a second set of decoupling capacitors.
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机译:IC包括单元阵列和第一组端盖单元。单元阵列包括耦合到第一电压的第一组M x Sub>层电源互连,第一组M x Sub>层互连,第二组M x Sub>层电源互连耦合到第二电压源,第二组M x Sub>层互连。第一组端盖单元包括第一和第二组M x + 1 Sub>层互连。第一组M x + 1 Sub>层互连与第一组M x Sub>层电源互连以及第二组Mx层互连相连,以提供第一组去耦电容器。第二组M x + 1 Sub>层互连与第二组Mx层电源互连和第一组M x Sub>层互连互连,以提供第二组去耦电容器。
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