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EARPHONE REAR CAVITY STRUCTURE

机译:耳机后腔结构

摘要

The present solution provides an earphone rear cavity structure, comprising an earphone casing having a rear cavity. The rear cavity is provided with a mounting position for placing a speaker (6); a speaker surface for transmitting a sound of the speaker (6) is provided at the mounting position; the speaker (6) is provided with a sound generation surface for making a sound, and the sound generation surface is provided opposite to the speaker surface; a connection member (10) is provided at the edge of an opening of the rear cavity; and a microphone is provided on the connection member (10). According to the present solution, by providing a mounting position in a rear cavity of an earphone casing (1), providing a speaker surface at the mounting position, providing a speaker (6) at the mounting position, configuring a sound generation surface to be opposite to the speaker surface, providing a connection member (10) at a rear cavity cover, and providing a microphone on the connection member (10), an independent speaker cavity is provided in the earphone casing, and the microphone is located in the speaker cavity, so that the earphones can be better noise-reduced, and the noise reduction effect is improved.
机译:本解决方案提供了一种耳机后腔结构,其包括具有后腔的耳机壳体。后腔设有用于放置扬声器(6)的安装位置;在安装位置处设置有用于传递扬声器(6)的声音的扬声器表面。扬声器(6)具有用于产生声音的发声面,该发声面与扬声器面相对设置。在后腔的开口的边缘处设置有连接构件(10)。在连接部件(10)上设有麦克风。根据本解决方案,通过在耳机壳体(1)的后腔中提供安装位置,在安装位置提供扬声器表面,在安装位置提供扬声器(6),将声音产生表面构造为与扬声器表面相对,在后腔盖处提供连接部件(10),并在连接部件(10)上提供麦克风,在耳机壳体中提供独立的扬声器腔,并且麦克风位于扬声器中腔体,可以更好地降低耳机的噪声,提高降噪效果。

著录项

  • 公开/公告号WO2019042462A1

    专利类型

  • 公开/公告日2019-03-07

    原文格式PDF

  • 申请/专利权人 SHENZHEN MEIDONG ACOUSTICS CO. LTD.;

    申请/专利号WO2018CN103950

  • 发明设计人 MEI QINGKAI;

    申请日2018-09-04

  • 分类号H04R1/10;

  • 国家 WO

  • 入库时间 2022-08-21 11:56:19

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