SEMICONDUCTOR BACK SURFACE CONTACT FILM AND DICING TAPE-INTEGRATED SEMICONDUCTOR BACK SURFACE CONTACT FILM

摘要

Provided is a semiconductor back surface contact film capable of rendering wrinkling thereof difficult when peeled off from a separator. This semiconductor back surface contact film has a planar projection area of 22500 mm² or more, and has a non-circular planar projection shape having at least one R-portion in which a curvature radius R1 is 0.5-10 mm. This dicing tape-integrated semiconductor back surface contact film includes: a dicing tape which has a laminated structure including a base material and an adhesive layer; and the semiconductor back surface contact film which is peelably in contact with the adhesive layer of the dicing tape, wherein the dicing tape has a planar projection area larger than the semiconductor back surface contact film and has a planar projection shape having an R-portion.