首页> 外国专利> SILICON NANOWIRES FORMED BETWEEN TOP AND BOTTOM OF MICROSCALE SENSOR STRUCTURES AND MANUFACTURING METHOD THEREOF

SILICON NANOWIRES FORMED BETWEEN TOP AND BOTTOM OF MICROSCALE SENSOR STRUCTURES AND MANUFACTURING METHOD THEREOF

机译:微尺度传感器结构的顶部和底部之间形成的硅纳米线及其制造方法

摘要

Embodiments relate to a method of manufacturing a nanowire disposed between a top and a bottom of a microscale sensor structure, including: a step (S100) of forming a first oxide film on a silicon substrate; a step (S200) of etching the silicon substrate by using the first oxide film as a mask, such that a recessed region for dividing a nano-column structure and the microscale sensor structure is formed; a step (S300) of forming a second oxide film on the silicon substrate through a thermal oxidation process; a step (S400) of further etching the recessed region by a predetermined depth in a vertical direction; a step (S500) of forming a third oxide film on the silicon substrate through the thermal oxidation process; and a step (S600) of etching the silicon substrate such that floating nanowires are formed as a bottom of the nano-column structure is removed. Accordingly, a residual stress applied to both ends of the nanowire is reduced.
机译:实施例涉及一种制造布置在微尺度传感器结构的顶部和底部之间的纳米线的方法,该方法包括:在硅衬底上形成第一氧化物膜的步骤(S100);以及在硅衬底上形成第一氧化物膜的步骤。步骤S200,以第一氧化膜为掩模,对硅基板进行刻蚀,形成用于划分纳米柱结构和微米级传感器结构的凹陷区域。步骤S300,通过热氧化工艺在硅基板上形成第二氧化膜;步骤(S400),进一步在垂直方向上将凹陷区域蚀刻预定深度。步骤(S500),通过热氧化工艺在硅基板上形成第三氧化膜;步骤S600,刻蚀硅基板,使得随着纳米柱结构的底部的去除而形成浮动纳米线。因此,减小了施加到纳米线的两端的残余应力。

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