Laser Processing Apparatus For Forming Multi Crack Into Cutting Semiconductor Wafer

摘要

The laser processing apparatus according to an embodiment of the present invention sets a light-converging point of an S-polarized laser beam and a light-converging point of a P-polarized laser beam differently, And the S-polarized laser beam is made incident on the object to be processed so that the angle of the beam is maintained in a parallel state through the first multi-focus unit and the second multi-focus unit in which the interval between the concave lens and the convex lens is set to be different from each other And the P-polarized laser beam causes the angle of the beam to change to a converging state, so that the light-converging points of the laser beams are set to be different from each other.