Chamber for automated management of wafers with improved management efficiency

摘要

The present invention relates to a chamber for an automatic wafer management apparatus with improved management efficiency. More specifically, the chamber for an automatic wafer management apparatus with improved management efficiency comprises: a first chamber disposed in one end of an equipment front and end module (EFEM) for transferring a wafer to remove foreign matters and fume from a loaded wafer; a second chamber disposed on one side end of the one end of the EFEM for transferring a wafer to remove foreign matters and fume from the loaded wafer; a first gas heating unit to heat gas supplied to the first chamber; and a gas heating unit to heat gas supplied to the second chamber. Accordingly, while the gas is injected toward a plurality of wafers loaded in each chamber, the foreign matters and the fume are able to be easily separated as the heated gas is injected, and a dead zone is prevented due to improvement of entire discharge efficiency, thereby improving the wafer management efficiency.