首页> 外国专利> Method of manufacturing epitaxial silicon wafer, epitaxial silicon wafer, and method of manufacturing solid-state imaging device

Method of manufacturing epitaxial silicon wafer, epitaxial silicon wafer, and method of manufacturing solid-state imaging device

机译:外延硅晶片的制造方法,外延硅晶片和固态成像装置的制造方法

摘要

The present invention provides an epitaxial silicon wafer capable of suppressing metal contamination by exhibiting a higher gettering ability, and a manufacturing method thereof. A first silicon epitaxial layer 12 on a silicon wafer 10, a first modified layer 14 formed by injecting carbon into the surface layer portion of the first silicon epitaxial layer 12, The method of manufacturing an epitaxial silicon wafer (100) having a first silicon epitaxial layer (16) on a first reforming layer (14), characterized in that after forming a second silicon epitaxial layer (16) ) to less than 2 × 10 17 atoms / ㎤ the peak concentration of the oxygen concentration profile in, and further, the is characterized in that the oxygen concentration of the second silicon epitaxial layer (16) below the SIMS detection limit.
机译:本发明提供能够通过表现出更高的吸杂能力来抑制金属污染的外延硅晶片及其制造方法。硅晶片10上的第一硅外延层12,通过向第一硅外延层12的表层部分注入碳而形成的第一改性层14,具有第一硅外延的外延硅晶片(100)的制造方法在第一重整层(14)上形成层(16),其特征在于,在形成第二硅外延层(16)之后,氧的峰值浓度小于2×10 17 原子/㎤此外,其特征在于第二硅外延层(16)的氧浓度低于SIMS检测极限。

著录项

  • 公开/公告号KR20190017039A

    专利类型

  • 公开/公告日2019-02-19

    原文格式PDF

  • 申请/专利权人 가부시키가이샤 사무코;

    申请/专利号KR20197000949

  • 发明设计人 마사다 아유미;

    申请日2017-04-25

  • 分类号H01L21/02;H01L21/265;H01L21/66;H01L27/146;

  • 国家 KR

  • 入库时间 2022-08-21 11:51:37

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号