Photosensitive resin composition, photosensitive sheet, cured film, element, organic EL display device, semiconductor electronic component, semiconductor device and manufacturing method of organic EL display device

摘要

The present invention provides a highly sensitive photosensitive resin composition having a high residual film ratio after development and high bending resistance in a cured film. (A) an alkali-soluble resin, and (b) a photosensitive compound, wherein the alkali-soluble resin (a) has 95 to 100 mol% as a repeating unit the structure represented by the general formula (1) a) a photosensitive resin composition having an organic group derived from a monoamine or an acid anhydride at least at one end of a polymer molecular chain in an alkali-soluble resin. (In the general formula (1), R^OneRepresents a divalent organic group, R²And R³Each independently represent hydrogen or an organic group having 1 to 20 carbon atoms, and X^OneAnd X²Each independently represent a linear or branched alkylene group having 1 to 20 carbon atoms, a 1,3-phenylene group or a 1,4-phenylene group, R^One, X^OneAnd X²M and n are integers within a range of 0 to 100,000, and m + n 3, respectively, in the plurality of repeating units,