SUBSTRATE CLEANING METHOD AND SUBSTRATE CLEANNG APPARATUS

摘要

A substrate cleaning method comprises: a processing liquid supply step of supplying a processing liquid that contains a solute and a volatile solvent to an upper surface of a substrate; a film forming step of volatilizing at least a portion of the solvent, from the processing liquid supplied to the upper surface of the substrate, and solidifying or hardening the processing liquid to form a particle holding layer on the upper surface of the substrate; and a removal step of supplying a peeling liquid for peeling the particle holding layer to the upper surface of the substrate, and peeling the particle holding layer to remove the same from the upper surface of the substrate. A solute composition that is the solute contained in the particle holding layer has properties that it is insoluble in the peeling liquid before being heated at a temperature equal to or higher than a quality-changing temperature and it is also changed in quality by being heated at a temperature equal to or higher than the quality-changing temperature and becomes soluble in the peeling liquid. The film forming step includes a heating step of heating the processing liquid supplied to the upper surface of the substrate at a temperature less than the quality-changing temperature, and forming the particle holding layer on the upper surface of the substrate, with no change in quality of the solute composition. The substrate cleaning method further comprises a residue removal step of supplying a residue removing liquid which has the property of dissolving the solute composition before being heated at a temperature equal to or higher than the quality-changing temperature, to the upper surface of the substrate after the removal step, and removing residues that remain on the upper surface of the substrate after the particle holding layer has been removed.