首页> 外国专利> 3 3DIMENSIONAL FLASH MEMORY DEVICE INCLUDING VERTICAL CHANNEL STRUCTURE WITH DIFFERENT HOLE SIZE AND THE MANUFACTURING METHOD THEREOF

3 3DIMENSIONAL FLASH MEMORY DEVICE INCLUDING VERTICAL CHANNEL STRUCTURE WITH DIFFERENT HOLE SIZE AND THE MANUFACTURING METHOD THEREOF

机译:3包括不同孔尺寸的垂直通道结构的三维闪存装置及其制造方法

摘要

The present invention relates to a three-dimensional flash memory element including a vertical channel structure having different hole sizes formed therein and a manufacturing method thereof. A structure including different hole sizes for each vertical cell group is formed so as to form a stable vertical channel layer in a high-stage three-dimensional flash memory architecture of 100 stages or greater.
机译:三维闪存元件及其制造方法技术领域本发明涉及一种三维闪存元件及其制造方法,该三维闪存元件包括其中形成有不同孔尺寸的垂直沟道结构。形成包括针对每个垂直单元组的不同孔尺寸的结构,以在100级以上的高级三维立体闪存架构中形成稳定的垂直沟道层。

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