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3 3DIMENSIONAL FLASH MEMORY DEVICE INCLUDING VERTICAL CHANNEL STRUCTURE WITH DIFFERENT HOLE SIZE AND THE MANUFACTURING METHOD THEREOF
3 3DIMENSIONAL FLASH MEMORY DEVICE INCLUDING VERTICAL CHANNEL STRUCTURE WITH DIFFERENT HOLE SIZE AND THE MANUFACTURING METHOD THEREOF
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机译:3包括不同孔尺寸的垂直通道结构的三维闪存装置及其制造方法
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摘要
The present invention relates to a three-dimensional flash memory device including a vertical channel structure formed in a different hole size and a method for manufacturing the same, forming a structure including a different hole size (Hole size) for each vertical cell group 100 or more stages It is possible to form a stable vertical channel layer in a high-speed three-dimensional flash memory architecture.
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