3 method of testing 3D type multi layer semiconductor device in the process of stacking chip

摘要

Disclosed is an intermediate inspection method for a chip stacking process of a 3D multilayer semiconductor device. According to the present invention, the intermediate inspection method performs optical inspection with pattern inspection equipment having an auto-focusing function while relatively moving on a plane between an optical inspection system and an object when an upper chip is stacked after a stacking step of stacking the upper chip on a lower chip in a 3D multilayer semiconductor device manufacturing process to detect a position change in the height direction on a surface of the upper chip, and determines chip stacking defect at the position of the corresponding upper chip based on a detection result. Accordingly, a defective chip portion, which may cause a vertical contact defect, is checked through an optical inspection for a portion exposed to the outside while stacking up a chip in a process for forming a 3D multilayer semiconductor device such that following processes are prevented from being performed in the portion, thereby reducing processing load and cost and a defective rate of the completed 3D multilayer semiconductor device.