3 method of testing 3D type multi layer semiconductor device in the process of stacking chip

摘要

After the stacking process step of performing the upper chip stacking process on the lower chip in the process of manufacturing the three-dimensional stacked semiconductor device, a pattern inspection device having an auto-focus function with the upper chip stacked, Detecting a change in height position of the upper chip surface by performing optical inspection while relatively moving the position on the upper chip position and determining a chip stacking failure at the upper chip position based on the detected result, An interim inspection method for a semiconductor device chip stacking process is disclosed. According to the method of the present invention, in the step of forming a three-dimensional laminated semiconductor device, a portion of a defective chip, which may cause a defective vertical connection, is identified through optical inspection of a portion exposed to the outside while stacking chips, It is possible to reduce the process burden and the cost, and to reduce the defective ratio of the completed three-dimensional stacked semiconductor device.