System, method for training and applying a defect classifier in wafers with deeply stacked layers

摘要

A system, method, and non-transitory computer readable medium are provided for training and applying defect classifiers in wafers having deeply stacked layers. In use, a plurality of images generated by the inspection system are obtained for the location of defects detected on the wafer by the inspection system. The location on the wafer consists of a plurality of stacked layers, where each image of the plurality of images is generated by the inspection system at that location using different focusing settings. In addition, the classification of the defect is determined using a plurality of images.