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System, method for training and applying defect classifiers in wafers having deeply stacked layers
System, method for training and applying defect classifiers in wafers having deeply stacked layers
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机译:系统,用于在具有深层堆叠层的晶片中训练和应用缺陷分类的方法
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摘要
A system, method, and non-transitory computer readable medium are provided for training and applying defect classifiers in wafers having deeply stacked layers. In use, a plurality of images generated by an inspection system for a location of a defect detected on a wafer by the inspection system are acquired. The location on the wafer is comprised of a plurality of stacked layers, and each image of the plurality of images is generated by the inspection system at the location using a different focus setting. Further, a classification of the defect is determined, utilizing the plurality of images.
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