Sputter deposition apparatus for coating a substrate and method for performing the sputter deposition process

摘要

A sputter deposition apparatus is provided. The sputter deposition apparatus includes a plurality of cathode assemblies configured to sputter target material in a sputter deposition process, each of the plurality of cathode assemblies comprising a rotatable target and a magnet assembly arranged within the rotatable target, the plurality of cathode assemblies The outermost cathode assembly is included. The sputter deposition apparatus further includes a plurality of anode elements configured to affect a plasma generated in the sputter deposition process, the plurality of anode elements including an outermost anode element. The sputter deposition apparatus further includes an auxiliary magnet assembly. The outermost cathode assembly, outermost anode element and auxiliary magnet assembly are arranged in this order and the auxiliary magnet assembly is configured to provide a magnetic field to compensate for the boundary effect in the outer region of the plasma.